TSMC’s Capital Expenditure Last Year Was $17 Billion

The report also mentioned that TSMC expects that in 2021, with the construction of 3nm capacity and the manufacturing of 5nm factories in the United States, capital expenditure will exceed US$20 billion.

The latest survey also shows that, driven by the increase in demand for home office and entertainment equipment due to the epidemic, the large-scale launch of 5G smartphones, and the large-scale construction of 5G base stations, the global chip foundry market will grow substantially in 2020. Research institutions are expected to scale Reached 84.652 billion US dollars, a year-on-year growth rate of 23.7%.
For 2021, research institutions predict that the scale of the global chip foundry market will continue to grow, but the year-on-year growth rate will be significantly slower than in 2020.
It was previously reported that TSMC is raising more funds in order to purchase more advanced EUV lithography machines from ASML, and these are all preparations for the new process.
It is reported that TSMC’s research on materials has also made 1nm possible. TSMC and Jiaotong University have jointly developed the world’s thinnest ultra-thin two-dimensional semiconductor material insulator with a thickness of only 0.7 nanometers, which is expected to further develop 2 nanometer or even 1 nanometer transistor channels.
In addition, TSMC is continuing to find sites for advanced manufacturing processes beyond 2nm, including Qiaotou Branch and Luzhu Branch, which are all considered by TSMC in its evaluation of medium and long-term investment and plant construction.